Home > News > Rapid prototype technologies (RP) Classification and disadvantages

Rapid prototype technologies (RP) Classification and disadvantages

2019-03-03
The popular rapid prototyping technology (RP) is currently:
CNC Machining, Stereolithography (SLA), 3D Printing, Laminated Manufacturing (LOM), Selective Laser Sintering (SLS), Melt Stacking Law (FDM).

But there are still some problems that need to be researched and improved in engineering practice:
1. Accuracy and resolution are limited to 0.1mm or more.
2. Edge thermal damage and burrs caused by heat fusion during Laser Cutting result in poor contour accuracy and surface roughness of the formed parts.
3. With the micro-hole injection and extrusion molding technology, the micro-holes are easy to be blocked, and the working reliability needs to be improved.
4. Some processes using vertical cutting have to minimize the thickness of each layer in order to reduce the step effect and improve the accuracy, which limits the manufacturing speed.
5. Most processes are limited to one or a few materials, for example: SLS limited to paraffin, plastics, metals, ceramics and other powdered thermoplastic materials: SLA limited to thermosetting photosensitive resin: LOM is limited to paper, metal foil, plastic film and other thin materials: FDM Limited to waxes, thermoplastic resins, low melting point metals, etc. 2 Thick-Layer Manufacturing Technology Principles and Features of Cut-Cutting-Cutting Contours These shortcomings hinder the commercial application of RP.
Therefore, in the next few years, RP technology with high accuracy, low cost, and wide range of applicable materials will be the mainstream of research and development in this field.
Related Products List

Home

Product

Phone

About Us

Inquiry

We will contact you immediately

Fill in more information so that we can get in touch with you faster

Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.

Send